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6001394
RF and Wireless
RF Transceiver Modules and Modems
6001394
：
6001394
：
RF Transceiver Modules and Modems
：
Sierra Wireless AirLink
：
IC
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-
：
Retail Package
：
1
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:
:
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*
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*
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6001394
：
RF Transceiver Modules and Modems
：
Sierra Wireless AirLink
：
IC
：
-
：
Retail Package
：
0
：
6001394
宏致-ACES
1.27mm Pitch Pin Header Conn. SMT D/R S/T Type
6001394
微芯-Microchip
1310 nm, 1550 nm, 1.5 Gbps PIN Preamplifier for SDI HDTV
6001394
三星-Samsung
多制层封装芯片
6001394
三星-Samsung
多制层封装芯片
6001394
三星-Samsung
MCP
6001394
三星-Samsung
MCP
6001394
力特-Littelfuse
微型TR3保险丝
6001394
力特-Littelfuse
微型TR3保险丝
6001394
玖信-Qotana
开关
6001394
桑德斯-SMC
TVS Die-GPP
6001394
桑德斯-SMC
TVS Die-GPP
6001394
桑德斯-SMC
TVS Die-GPP
6001394
桑德斯-SMC
TVS Die-GPP
6001394
Powerex
Phase Control SCR (300 Amperes Avg 100-2000 Volts)
6001394
罗姆-ROHM
Isolation voltage 2500Vrms 1ch Gate Driver Providing Galvanic Isolation
6001394
瑞萨-Renesas
IC FREQ GENERATOR/BUFFER 48-SSOP
6001394
瑞萨-Renesas
IC FREQ GENERATOR/BUFFER 48-SSOP
6001394
泰科-TE
板对板连接器
6001394
莫仕-Molex
压线端子胶壳
6001394
莫仕-Molex
冷压端子
6001394
泰科-TE
板对板连接器
6001394
莫仕-Molex
连接器
6001394
宏致-ACES
1.27mm Pitch Pin Header Conn. SMT D/R S/T Type
6001394
微芯-Microchip
1310 nm, 1550 nm, 1.5 Gbps PIN Preamplifier for SDI HDTV
6001394
三星-Samsung
多制层封装芯片
6001394
三星-Samsung
多制层封装芯片
6001394
三星-Samsung
MCP
6001394
三星-Samsung
MCP
6001394
力特-Littelfuse
微型TR3保险丝
6001394
力特-Littelfuse
微型TR3保险丝
6001394
玖信-Qotana
开关
6001394
桑德斯-SMC
TVS Die-GPP
6001394
桑德斯-SMC
TVS Die-GPP
6001394
桑德斯-SMC
TVS Die-GPP
6001394
桑德斯-SMC
TVS Die-GPP
6001394
Powerex
Phase Control SCR (300 Amperes Avg 100-2000 Volts)
6001394
罗姆-ROHM
Isolation voltage 2500Vrms 1ch Gate Driver Providing Galvanic Isolation
6001394
瑞萨-Renesas
IC FREQ GENERATOR/BUFFER 48-SSOP
6001394
瑞萨-Renesas
IC FREQ GENERATOR/BUFFER 48-SSOP
6001394
泰科-TE
板对板连接器
6001394
莫仕-Molex
压线端子胶壳
6001394
莫仕-Molex
冷压端子
6001394
泰科-TE
板对板连接器
6001394
莫仕-Molex
连接器
TYPE
DESCRIPTION
Mfr
Sierra Wireless AirLink
Series
-
Package
Retail Package
Product Status
ACTIVE
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